![](https://d15shllkswkct0.cloudfront.net/wp-content/blogs.dir/1/files/2024/07/AI-Factory-DallE-copy.png)
US announces $1.6B to fund research in advanced chip packaging technologies
The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies. The Biden administration has earmarked $1.6 billion in …