Call for Papers Now Open for 2009 Advanced Metallization Conference

June 3, 2009

Submission Deadline is June 26, 2009

BERKELEY, Calif., June 3 /PRNewswire-USNewswire/ -- UC Berkeley Extension announced today that abstracts for paper presentations are now being accepted for the 26th Advanced Metallization Conference (AMC) which will be held October 13-15, 2009, in Baltimore, Maryland. The submission deadline for abstracts is June 26, 2009.

The conference draws technical leaders from around the world to discuss leading-edge research in the field of advanced metallization and 3-D integration for ULSI IC applications. "The meeting provides a forum for open discussion of critical issues affecting state-of-the-art and future directions in interconnect systems. It's a great opportunity for collaboration on new cutting-edge research," said Stefan E. Schulz, Professor for Nanoelectronics Technologies at Chemnitz University of Technology, Germany and co-chair of the conference. "This year we widened the thin film metallization paper topics to include application in solar cells. We encourage experts in this area to share their challenges and R&D results in metallization topics by submitting their papers to AMC." Topics include both fundamental and applied research, as well as advanced interconnect materials issues, manufacturing unit process development, full integration data, interconnect reliability, and IC wiring scaling.

Presentations must be original, non-commercial and non-published works, and focus on ULSI IC metallization and associated subjects such as ultra low-k dielectrics, scaling effects on resistance, diffusion barriers, metal/dielectric planarization emphasizing CMP, electrochemical and electroless deposition processes in advanced metallization, novel interconnect systems concepts such as vertical, optical and RF issues, chip interconnect/packaging interface including 3-D integration as well as metallization technologies for micro-system-technology and solar cell applications.

Abstracts of approximately 250 words are due by June 26, 2009. Abstracts submitted electronically must be a PDF file with all fonts embedded. Send abstracts to amc@unex.berkeley.edu.

Papers presented at the conference will be published by the Materials Research Society. In the past, the books resulting from this meeting have been very popular, and have found highest acceptance as information sources for advanced metallization.

A complete list of topic areas for papers is available at:

www.unex.berkeley.edu/eng/metal/call.html#topics.

For additional information, please contact: amc@unex.berkeley.edu; (510)

642-4151

SOURCE UC Berkeley Extension